WeAct STM32F401CCU6 Black-Pill: high-resolution pinout and specs

by Renzo Mischianti · Published 6 June 2022 · Updated 6 June 2022

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STM32 STM32F401 STM32F401CCU6 pinout low resolution

Link to the high resolution pinout image

Here the most used STM32 boards STM32F103C8T6 STM32F401 STM32F411 ST-Link v2 ST-Link v2 official

Description

The STM32F401xB/STM32F401xC devices are based on the high-performance Arm^® Cortex^® -M4 32-bit RISC core operating at a frequency of up to 84 MHz. The Cortex^®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The STM32F401xB/STM32F401xC incorporate high-speed embedded memories, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer one 12-bit ADC, a low-power RTC, six general-purpose 16-bit timers including one PWM timer for motor control, two general-purpose 32-bit timers. They also feature standard and advanced communication interfaces.
The STM32F401xB/STM32F401xC operate in the – 40 to + 125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
These features make the STM32F401xB/STM32F401xC microcontrollers suitable for a wide range of applications. (from ST)

All STM32401 have pins 5v tolerant (green square in the pinout diagram)

This board type offers a socket to the bottom to add an External SPI Flash, and SPI1 CS/SCK/MISO/MOSI (PA4/PA5/PA6/PA7) are Routed to the footprint for external flash.

Specs

Dynamic efficiency line with BAM (batch acquisition mode)
- 1.7 V to 3.6 V power supply
- -40 °C to 85/105/125 °C temperature range
Core: Arm^® 32-bit Cortex^®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 84 MHz, memory protection unit, 105 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
Memories
- Up to 256 Kbytes of Flash memory
- 512 bytes of OTP memory
- Up to 64 Kbytes of SRAM
Clock, reset and supply management
- 1.7 V to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- 4-to-26 MHz crystal oscillator
- Internal 16 MHz factory-trimmed RC
- 32 kHz oscillator for RTC with calibration
- Internal 32 kHz RC with calibration
Power consumption
- Run: 128 μA/MHz (peripheral off)
- Stop (Flash in Stop mode, fast wakeup time): 42 μA typ @ 25 °C;65 μA max @25 °C
- Stop (Flash in Deep power down mode, slow wakeup time): down to 10 μA typ@ 25 °C; 28 μA max @25 °C
- Standby: 2.4 μA @25 °C / 1.7 V without RTC; 12 μA @85 °C @1.7 V
- V_BAT supply for RTC: 1 μA @25 °C
1×12-bit, 2.4 MSPS A/D converter: up to 16 channels
General-purpose DMA: 16-stream DMA controllers with FIFOs and burst support
Up to 11 timers: up to six 16-bit, two 32-bit timers up to 84 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window) and a SysTick timer

Debug mode
- Serial wire debug (SWD) & JTAG interfaces
- Cortex^®-M4 Embedded Trace Macrocell™
Up to 81 I/O ports with interrupt capability
- All IO ports 5 V tolerant
- Up to 78 fast I/Os up to 42 MHz
Up to 11 communication interfaces
- Up to 3 × I²C interfaces (1Mbit/s, SMBus/PMBus)
- Up to 3 USARTs (2 x 10.5 Mbit/s, 1 x 5.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control)
- Up to 4 SPIs (up to 42 Mbits/s at f_CPU= 84 MHz), SPI2 and SPI3 with muxed full-duplex I²S to achieve audio class accuracy via internal audio PLL or external clock
- SDIO interface
Advanced connectivity
- USB 2.0 full-speed device/host/OTG controller with on-chip PHY
CRC calculation unit
96-bit unique ID
RTC: subsecond accuracy, hardware calendar